Ultrasonic Wire Splicing System from TELSONIC Ultrasonics
TELSONIC Ultrasonics, a Swiss based company specialized in ultrasonic technology, introduces the innovative ultrasonic wire splicing system «TelsoSplice» to the cable and wire harness processing industry. Outstanding features are the large cross section range, the extreme mechanical rigidity and with it, a perfect reproducibility of the splicing quality, simple, fast, and secure tool changing as well as a very user friendly touch screen software with innovative operation modes and quality detection features.
The ultrasonic wire splicer TelsoSplice is available as table, board and module version and offers the following features and advantages - small and light weight modules (length 320 mm, weight 12 kg); equal modules in board splicing and tabletop versions; cross section range from 0.5 mm2 to 45 mm2; extremely stable and rigid design; automatic calibration of the machine; simple, fast and secure tool changing; very user friendly touch screen software and networking option with multiple machines.
LATEST issue 1/2019
The first issue of the South-East European Industrial Market Magazine for 2019 is already available online! In the edition you may find many interesting topics and articles, including "Chemical and pharmaceutical industry in Serbia", "Textile industry in North Macedonia", etc. The whole issue you may find here...
System developers designing high-end embedded control applications with multiple software teams can now benefit from a new family of dual-core Digital Signal Controllers (DSCs) in a single chip from Microchip Technology, enabling easier software integration. See more...