SIPLACE Team receives 2009 Global Technology Award
• News • South-East European INDUSTRIAL Мarket - issue 5/2009
The latest generation of SIPLACE placement solutions impressed not only the visitors, but also the trade journalists at this year’s Productronica, the industry’s leading trade show (Munich Trade Fair Centre, Nov. 10-13, 2009). The jury assembled for Global SMT & Packaging Magazine’s coveted Global Technology Award selected SIPLACE and honored the new SIPLACE SX placement platform as the winner for 2009 in the category ’Pick & Place high volume equipment’. The award is presented for the development of the world’s most important technical innovations by a panel of well-known, independent industry journalists. The SIPLACE SX with its rail-mounted interchangeable gantries and MultiStar CPP head is the world’s first platform that offers consistent capacity-on-demand capabilities, thus giving electronics manufacturers the flexibility they need to scale their production up or down. It also opens the door to modern, highly flexible build-to-order concepts for the global SMT industry.
"Our team is especially proud of this award. It confirms that the SIPLACE SX is the right answer to the electronics manufacturing industry’s current and future requirements. The SIPLACE SX with its capacity-on-demand concept combines innovations in hardware, software and services and sets a major milestone on the path to high-mix build-to-order production in the electronics industry. The award confirms our strategy to focus our development activities on highly flexible BTO concepts," said Ray Bruce, Vice President Customer Relationship Management on the global SIPLACE team.
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