parts2clean 2022 to offer comprehensive supporting program

Electromobility and the energy transition, changes in manufacturing and coating technologies, new materials and material combinations and the digitization of manufacturing are just a few of the trends requiring new and adapted processes in parts and surface cleaning. Apart from particulate contaminants, an increasingly important aspect involves filmic organic, inorganic and, in some cases, biological contaminants in the fight to meet cleanliness specifications.

“The exhibitor showcases at this year’s parts2clean will offer solutions in all areas of industrial cleaning technology to meet these new requirements in a leading-edge context,” reports Hendrik Engelking, Global Director at Deutsche Messe. The international trade fair for parts and surface cleaning runs from 11 to 13 October 2022 at the Stuttgart Exhibition Center. The supporting program’s side events offer knowledge and expertise as well as solution approaches for process adaptation and optimization in a condensed form.

Pre-defined cleanliness requirements can be met stably and efficiently by taking a holistic view of the process chain. This includes – as a result of increasingly stiff requirements for component cleanliness – environmental conditions as well. The special show titled “Component Cleanliness – a Holistic View of the Process Chain,” organized jointly with the Cleaning Excellence Center (CEC), provides visitors with a better grasp of the road to clean components.

With traditional attendance of more than 1300 participants on-site and many more users worldwide via live streaming, the three-day parts2clean specialist forum is one of the key attractions at the show. Well-known experts from science and research as well as from industry associations and industry itself will offer their knowledge and expertise as well as benchmark solutions in simultaneously translated lectures on the following topics: Basics of industrial cleaning processes, digitization, automation and process monitoring as well as challenges due to filmic contamination.