Microchip’s RTG4 FPGAs with lead-free flip-chip bumps receive highest qualification for space applications

Electronics NewsSouth-East European INDUSTRIAL Мarket - issue 4/2024 • 04.11.2024

Microchip’s RTG4 FPGAs with lead-free flip-chip bumps receive highest qualification for space applications

The Qualified Manufacturers List (QML) Class V designation has been granted to Microchip Technology’s Radiation-Tolerant (RT) RTG4TM Field-Programmable Gate Arrays (FPGAs) with lead-free flip-chip bumps. The Defense Logistics Agency (DLA) has designated QML Class V as the highest qualification level for space components. It is a prerequisite for meeting mission assurance requirements on the most important space missions, including deep space, human-rated, and national security programs.

 

“This is another milestone for our RTG4 FPGAs that will provide customers with added confidence in designing these devices in space flight systems, while allowing them to take advantage of our high-reliability, zero-configuration-upset and low-power consumption FPGAs”, said Bruce Weyer, corporate vice president for Microchip’s FPGA business unit.

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