International Technical Fair TIB 2007
The 33rd edition of the International Technical Fair – TIB, took place between 2 and 6 October 2007 at Romexpo Exhibition Centre in Bucharest, Romania. The prestigious technical event gathered together 1 039 companies, out of which 53% Romanian and 47% foreign companies from 27 countries: Austria, Belgium, Bulgaria, Canada, China, Croatia, Switzerland, The Czech Republic, Estonia, Russia, France, Germany, Greece, Italy, Great Britain, Finland, The Netherlands, Poland, Slovakia, Slovenia, Spain, Swiss, Turkey, Tunisia, Ukraine and Hungary. The surface occupied by exhibitors totals 54 000 sq.m (42 000 sq.m inside and 12 000 on the outer platforms).
Foreign and Romanian exhibitors covered a wide range of industry sectors as usual: electrical engineering, electronics, automation, power engineering, telecommunications, energy, metallurgy, chemistry, welding, metal working, mechanical gears, pumps, compressors, fittings, etc.
South-East European industrial suppliers
were presented by Turkey with 43 participants, Bulgaria – 27, Greece – 3 and two from Croatia.
Compared to the 2006 edition, TIB 2007 registers both an over 20% increase of the exhibition surface, and an approximately 15% increase in its number of participants. This progress, according to the Romexpo officials, is mainly due to the development of the mechanical engineering sector, which has registered a 30% increase as against the previous edition, as well as to Romania’s integration in the European Union, a fact having also contributed to the increase in the number of foreign participants and the exhibition surface requested thereby.
For more accurate addressability, TIB was devided into
four main sectors
respectively Tooltech, Fluidtech, Electrotech, Metaltech and also in Car Engineering Show, Transport and Storage Show, Energetics Show, Chemistry and Petrochemistry Show.
The Research Show and the 11th edition of International exhibition for inventors, scientific research and new technologies INVENTIKA, held simultaneously with TIB at Romexpo Exhibition Centre. Besides the Romanian inventors there were participants from Croatia, Iran, Republic of Moldova, China and Russia.
LATEST issue 2/2022
The newest issue 2/2022 of the South-East European Industrial Market magazine is now available for reading online. Among the detailed editorials in the edition you will find articles dedicated to Greece’s mining industry, steel manufacturing in Turkey and Slovenia’s electronic components market. More about the latest industrial technologies, business projects and upcoming events in the SEE region you can learn here...
In the latest issue 2/2022 of SEEIM you can read more about the success of Endrich´s development team in recent weeks and months at domestic and international exhibitions and forums. The whole article you will find here...
SiC power devices by Microchip Technology are rugged, robust and apt for demanding applications within the transportation segment. A strong portfolio of standard, custom packaging options provide customers with flexibility in design. More details - here...
MAKTEK Eurasia 2022 Fair continues its preparations to welcome its visitors at TUYAP Fair Convention and Congress Center in Istanbul between September 26 and October 1. Which will be the highlighs of the event - find out here...