Eurasia Packaging to welcome more than 1200 companies in Istanbul

MachinesEventsSouth-East European INDUSTRIAL Мarket - issue 2/2023 • 27.06.2023

Eurasia Packaging to welcome more than 1200 companies in Istanbul

The Eurasia Packaging Istanbul Fair will gather innovative companies with future-ready solutions for the 28th time at Tuyap Fair and Congress Center between October 11-14, 2023 to display their creative packaging solutions and latest technologies. The fair, which attracted a total of 72 652 visitors from 122 countries including Turkiye in 2022, is getting ready for the 2023 event when it will allow manufacturing companies to meet with buyers from more than 120 countries around the world, in addition to the Turkish buyers.

 

As an effective commerce platform that demonstrates the strength, innovative capabilities and sustainability approach of the industry to local and international visitors, the fair makes a significant contribution to the Turkish packaging industry in its attempt to reach USD 50 billion in size by 2030 and its export target of USD 20 billion.

The 28th Eurasia Packaging Istanbul Fair is organized by RX Tuyap and cooperated with the Packaging Manufacturers Association (ASD) with the support of the Packaging Machinery Association (AMD), Label Manufacturers Association (ESD), Flexible Packaging Manufacturers Association (FASD), Carton Board Packaging Manufacturers Association (KASAD), Metal Packaging Manufacturers Association (MASD), Corrugated Board Packaging Manufacturers Association (OMUD), and Rigid Plastic Packaging Manufacturers Association (SEPA).

The Eurasia Packaging Fair is getting ready to welcome more than 1200 companies and company representatives in an indoor area of 120 000 square meters across a total of 14 halls. Visitors of the fair will have the chance to meet new suppliers and solution partners and to make equipment investments for their businesses during the Eurasia Packaging Istanbul Fair and the co-located Food-Tech Eurasia- the 17th International Food and Drink Technologies Fair.

Photo: RX Tuyap

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